General Features
32-bit MCU core, frequency，up to 128MHz
Maximum 128KB SRAM
512KB/1024KB Flash
High Reliability
Operating Temperature:-40℃~85℃
HBM ESD>6kv
EFT≥4.5kv
TK:10V dynamic CS
Rich Peripheral Interfaces
GPIO *64 / 6-channel DMA
Two 12-bits SAR-ADC/DAC
UART *5 / 2-channel PDM interfaces
Sixteen channels touch key sensor
Support USB、CAN、UART、SPI、I2C
High security
ECC/SM2、DES/AES、SHA256/SM3、SM4、CRC
RX sensitivity
1Mbps: -99.7dBm
2Mbps: -99.0dBm
TX Power: +13dBm (MAX)
TX Mode: 4.5mA @3.3V
RX Mode: 4.3mA @3.3V 0dBm
Deep sleep mode: 1.1uA (GPIO andRTC wake up)
At least 3 peripherals are required
Minimize chip size
ESD:HBM≥8KV
10V dynamic CS
Focusing on MCU+ solutions and ecological construction, linkedsemi has leading core technologies such as high-reliability design, high-performance and low-power simulation design, high-speed SerDes design, dedicated hardware acceleration module and algorithm design.
Data center/PC server
Industrial Control/BMC
Industrial
metering/Wearable
Healthcare/Wireless
SAR-ADC/ ADC
High speed
SerDes/Algorithm design
AIOT / Dev Kits
SDKs / Solutions
Excellent technical team
Professional technical
Strong technical core
About.
LINKEDSEMI
LINKEDSEMI is a fabless IC design company.It has system solution capabilities, underlying software capabilities, chip design capabilities, core IP independent research and development capabilities (MCU/BLE/RF/PMU/high-speed SerDes/high-precision AD/DA, etc.), industrial, vehicle planning, and specific process optimization capabilities.Based on the MCU/ Bluetooth SoC chip, LINKEDSEMI gradually expands to the PC control platform.
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